EN 60749-16:2003
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Published date
03-04-2003
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FOREWORD
1 Scope
2 Terms and definitions
3 General remarks
4 Equipment
5 Test procedure
6 Failure criteria
7 Lot acceptance (for guidance)
8 Detail specification
9 Summary
Bibliography
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60749-16 : 2003 | Identical |
| IEC 60749-16:2003 | Identical |
| NBN EN 60749-16 : 2004 | Identical |
| NEN EN IEC 60749-16 : 2003 | Identical |
| I.S. EN 60749-16:2003 | Identical |
| PN EN 60749-16 : 2005 | Identical |
| BS EN 60749-16:2003 | Identical |
| CEI EN 60749-16 : 2005 | Identical |
| DIN EN 60749-16:2003-09 | Identical |
| UNE-EN 60749-16:2003 | Identical |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
Summarise
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