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IEC 60749-29:2011

Current

Current

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

Available format(s)

Hardcopy , PDF

Language(s)

English, English - French

Published date

04-07-2011

US$228.00
Excluding Tax where applicable
Summarise this standard

FOREWORD
1 Scope and object
2 Terms and definitions
3 Classification and levels
4 Apparatus and material
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - Examples of special pins that are
        connected to passive components
Annex B (informative) - Calculation of operating ambient
        or operating case temperature for a given operating
        junction temperature

IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include:
- a number of minor technical changes;
- the addition of two new annexes covering the testing of special pins and temperature calculations.

Committee
TC 47
DevelopmentNote
Supersedes IEC PAS 62181. (11/2003) Stability Date: 2015. (10/2012)
DocumentType
Standard
Pages
52
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

US$228.00
Excluding Tax where applicable