MIL-C-46866 Base Document:1973
Withdrawn
Withdrawn
Compound, Insulating, Electrical and Application of (No S/S Document)
Available format(s)
PDF
Published date
03-23-1973
Publisher
Withdrawn date
07-23-2013
US$20.00
Excluding Tax where applicable
Specifies one type of heat-curing epoxy compound for transfer molding of delicate electronic assemblies.
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Withdrawn
|
| ASTM D 618 : 2013 : REDLINE | Standard Practice for Conditioning Plastics for Testing |
| MIL-P-14232 Revision E:1976 | PARTS, EQUIPMENT AND TOOLS FOR ARMY MATERIEL, PACKAGING OF (S/S BY MIL-STD-2073/1) |
| ASTM D 256 : 2015-10 | TEST METHODS FOR DETERMINING THE IZOD PENDULUM IMPACT RESISTANCE OF PLASTICS |
| ASTM D 790 : 2017 : REDLINE | Standard Test Methods for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials |
| ASTM D 648 : 2016 | Standard Test Method for Deflection Temperature of Plastics Under Flexural Load in the Edgewise Position |
| ASTM D 257 : 2014 : REDLINE | Standard Test Methods for DC Resistance or Conductance of Insulating Materials |
| MIL-I-16923 Revision H:1991 | Insulating Compound, Electrical, Embedding, Epoxy (S/S by A-A-59877) |
Summarise
US$20.00
Excluding Tax where applicable
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