Name: BS EN 61188-5-3:2007
Brand: BSI

Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides

Published date

31-12-2007

Publisher

British Standards Institution

INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 TSOP (Type 1)
  4.1 Field of application
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 TSOP (Type 2)
  5.1 Field of application
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 SOP
  6.1 Field of application
  6.2 Component description
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 SSOP
  7.1 Field of application
  7.2 Component description
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides.

IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.

Committee	EPL/501
DevelopmentNote	Supersedes 95/208506 DC & 95/208507 DC. (01/2008)
DocumentType	Standard
PublisherName	British Standards Institution
Status	Current
Supersedes	95/208506 DC : 0 95/208507 DC : 0

Standards	Relationship
EN 61188-5-3:2007	Identical
DIN EN 61188-5-3:2008-07	Identical
NF EN 61188-5-3 : 2016	Identical
IEC 61188-5-3:2007	Identical
I.S. EN 61188-5-3:2007	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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BS EN 61188-5-3:2007

Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides

Table of Contents

Abstract

Scope

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory