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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2007

Publisher

National Standards Authority of Ireland

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For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 TSOP (Type 1)
  4.1 Field of application
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 TSOP (Type 2)
  5.1 Field of application
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 SOP
  6.1 Field of application
  6.2 Component description
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 SSOP
  7.1 Field of application
  7.2 Component description
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	40
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
NF EN 61188-5-3 : 2016	Identical
EN 61188-5-3:2007	Identical
BS EN 61188-5-3:2007	Identical
DIN EN 61188-5-3:2008-07	Identical
IEC 61188-5-3:2007	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-1:2013	Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61188-5-1:2002	Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
IEC 61191-2:2017	Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

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I.S. EN 61188-5-3:2007

PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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