DIN EN 61188-5-3:2008-07
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
Hardcopy , PDF
German
01-01-2008
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 TSOP (Type 1)
4.1 Field of application
4.2 Component description
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 TSOP (Type 2)
5.1 Field of application
5.2 Component description
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
6 SOP
6.1 Field of application
6.2 Component description
6.3 Component dimensions
6.4 Solder joint fillet design
6.5 Land pattern dimensions
7 SSOP
7.1 Field of application
7.2 Component description
7.3 Component dimensions
7.4 Solder joint fillet design
7.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Bibliography
Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides.
| DevelopmentNote |
Applies in conjunction with DIN EN 61188-5-1 (2003-06). (07/2008)
|
| DocumentType |
Standard
|
| Pages |
31
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61188-5-3 : 2016 | Identical |
| EN 61188-5-3:2007 | Identical |
| BS EN 61188-5-3:2007 | Identical |
| I.S. EN 61188-5-3:2007 | Identical |
| IEC 61188-5-3:2007 | Identical |
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