BS EN IEC 60749-5:2024
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test
Hardcopy , PDF
English
06-02-2024
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.
| Standards | Relationship |
| IEC 60749-5:2023 | Identical |
| EN IEC 60749-5:2024 | Equivalent |
| DIN EN IEC 60749-5:2024-09 | Equivalent |
| UNE-EN IEC 60749-5:2024 | Equivalent |
| I.S. EN IEC 60749-5:2024 | Equivalent |
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