IEC 60747-12:1991
Withdrawn
Semiconductor devices - Part 12: Sectional specification foroptoelectronic devices
Hardcopy , PDF
English - French, Russian
09-15-1991
12-31-2021
FOREWORD
Clause
1 Scope
2 General
2.1 Related document
2.2 Recommended values of temperatures (preferred
values)
2.3 Recommended values of voltages and currents
(preferred values)
2.4 Terminal identification
3 Quality assessment procedures
3.1 Primary stage of manufacture and subcontracting
3.2 Structurally similar devices
3.2.1 Grouping for electrical and optical
characteristic tests in Groups A and/or B
3.2.2 Grouping for environmental and mechanical
tests in Groups B and/or C
3.2.3 Grouping for endurance tests
3.3 Inspection requirements for qualification approval
3.4 Quality conformance inspection
3.4.1 Division into groups and sub-groups
Table I - Group A: Lot by lot
Table II - Group B: Lot by lot
Table III - Group C: Periodic
3.5 Group D tests
3.6 Screening
Table IV- Screening (under consideration)
3.7 Sampling requirements
Table V - Sampling requirements for Group A tests
Table VI - Sampling requirements for Group B and C
tests, in which LTPD shall be used
4 Test and measurement procedures
4.1 Light emitting diodes, infrared emitting diodes,
general measurements
4.2 Photocouplers
4.3 Laser diodes
4.4 Photodiodes and phototransistors
4.5 Other devices (under consideration)
Appendix A - Structural similarity
Appendix B - Dimensions
Appendix C - Directions of applied forces for mechanical
tests
Gives details of the quality assessment procedures, the inspectionrequirements, screening sequences, sampling requirements, test andmeasurement procedures required for semiconductor optoelectronicdevices. Applies to:-Semiconductor photo-emitters;opto-electronic displays;light-emitting diodes (LED);laser diodes.-Semiconductor photosensitive devices;photodiodes;phototransistors;photothyristors.-Semiconductor imaging devices.-Photocouplers, optocouplers.
| Committee |
TC 47
|
| DocumentType |
Standard
|
| Pages |
39
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| PN IEC 747-12 : 1997 | Identical |
| BS QC 720100:1991 | Identical |
| BS QC 720102:1997 | Blank detail specification for laser diode modules with pigtail for fibre optic systems and subsystems |
| BS QC 720106:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Optoelectronic devices. Blank detail specification for avalanche photodiodes (APDs) with/without pigtail, for fibre optic systems or subsystems |
| BS QC720101(1995) : 1995 | DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR LIGHT EMITTING/INFRARED EMITTING DIODES WITH/WITHOUT PIGTAIL FOR FIBRE OPTIC SYSTEMS AND SUB-SYSTEMS |
| UTEC 80 810 : 2005 | RELIABILITY DATA HANDBOOK - UNIVERSAL MODEL FOR RELIABILITY PREDICTION OF ELECTRONICS COMPONENTS, PCBS AND EQUIPMENT |
| BS IEC 60747-12.1 : 1995 | DISCRETE SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS - BLANK DETAIL SPECIFICATION FOR LIGHT EMITTING/INFRARED EMITTING DIODES WITH/WITHOUT PIGTAIL FOR FIBRE OPTIC SYSTEMS AND SUB-SYSTEMS |
| IEC 60747-12-2:1995 | Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems |
| BS QC 720104:1997 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Optoelectronic devices. Blank detail specification for pin-FET modules with/without pigtail, for fibre optic systems or subsystems |
| IEC 60747-12-1:1995 | Semiconductor devices - Part 12: Optoelectronic devices - Section 1: Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fibre optic systems and sub-systems |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60747-10:1991 | Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |