NF EN 60749-4 : 2002
Withdrawn
Withdrawn
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
Published date
01-12-2013
Publisher
Withdrawn date
09-29-2021
Superseded by
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Foreword
1 Scope
2 HAST test - General remarks
3 Test apparatus
4 Test conditions
5 Procedure
6 Failure criteria
7 Safety
8 Summary
Bibliography
Gives a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.
| DevelopmentNote |
Indice de classement: C96-022-4. (03/2003) Supersedes NF EN 60749. (06/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| NBN EN 60749-4 : 2003 | Identical |
| I.S. EN 60749-4:2017 | Identical |
| BS EN 60749-4:2002 | Identical |
| IEC 60749-4:2017 | Identical |
| EN 60749-4:2017 | Identical |
| DIN EN 60749-4:2016-06 (Draft) | Identical |
| BS EN 60749-4:2017 | Identical |
| UNE-EN 60749-4:2003 | Identical |
| NF EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| NF EN 60749-5 : 2003 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST |
Summarise
Sorry this product is not available in your region.