NF EN 60749-30 : 2005 AMD 1 2011
Superseded
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
01-12-2013
11-01-2021
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
4.1 Moisture chamber
4.2 Solder equipment
4.3 Optical microscope
4.4 Electrical test equipment
4.5 Drying (bake) oven
4.6 Temperature cycle chamber (optional)
5 Procedure
5.1 General
5.2 Initial measurements
5.3 Temperature cycling (optional)
5.4 Drying (bake out)
5.5 Soak conditions for dry-packed SMDs
5.6 Method C for soak conditions for
non-dry-packed SMDs in accordance with
IEC 60749-20
5.7 Solder reflow
5.8 Flux application simulation (optional)
5.9 Final measurements
5.10 Applicable reliability tests
6 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Defines a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
| DevelopmentNote |
Indice de classement: C96-022-30 PR NF EN 60749-30 March 2004 (03/2004)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 60749-30:2011-12 | Identical |
| IEC 60749-30:2005+AMD1:2011 CSV | Identical |
| NBN EN 60749-30 : 2006 AMD 1 2011 | Identical |
| I.S. EN 60749-30:2005 | Identical |
| BS EN 60749-30 : 2005 | Identical |
| EN 60749-30 : 2005 AMD 1 2011 | Identical |
| UNE-EN 60749-30:2005 | Identical |