UNE-EN 60749-30:2005
Superseded
Superseded
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Available format(s)
Hardcopy , PDF
Published date
11-02-2005
Publisher
Superseded date
11-10-2020
US$85.50
Excluding Tax where applicable
| Committee |
CTN 209/SC 47
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Asociación Española de Normalización
|
| Status |
Superseded
|
| Standards | Relationship |
| IEC 60749-30:2005+AMD1:2011 CSV | Identical |
| EN 60749-30 : 2005 AMD 1 2011 | Identical |
| NBN EN 60749-30 : 2006 AMD 1 2011 | Identical |
| BS EN 60749-30 : 2005 | Identical |
| NF EN 60749-30 : 2005 AMD 1 2011 | Identical |
| DIN EN 60749-30:2011-12 | Identical |
| I.S. EN 60749-30:2005 | Identical |
| EN 60749-30:2005 | Identical |
| IEC 60749-30:2005 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
Summarise
US$85.50
Excluding Tax where applicable
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