IEC 60749-30:2005+AMD1:2011 CSV
Superseded
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Hardcopy , PDF
English - French
08-10-2011
09-12-2022
FOREWORD
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
5 Procedure
6 Summary
IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62182. (01/2005) Stability Date: 2015. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NF EN 60749-30 : 2005 AMD 1 2011 | Identical |
| NEN EN IEC 60749-30 : 2005 AMD 1 2011 | Identical |
| I.S. EN 60749-30:2005 | Identical |
| PN EN 60749-30 : 2007 AMD 1 2011 | Identical |
| BS EN 60749-30 : 2005 | Identical |
| EN 60749-30 : 2005 AMD 1 2011 | Identical |
| DIN EN 60749-30:2011-12 | Identical |
| UNE-EN 60749-30:2005 | Identical |
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