NF EN 60749-5 : 2003
Withdrawn
Withdrawn
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
Published date
01-12-2013
Publisher
Withdrawn date
10-04-2021
Superseded by
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Foreword
1 Scope
2 Normative references
3 General
4 Equipment
5 Test conditions
6 Procedures
7 Failure criteria
8 Safety
9 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding European
Publications
Covers a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
| DevelopmentNote |
Indice de Classement: C96-022-5 PR NF EN 60749-5 April 2002. (03/2002) Supersedes NF EN 60749. (06/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 60749-5:2017 | Identical |
| NBN EN 60749-5 : 2004 | Identical |
| BS EN 60749-5:2017 | Identical |
| EN 60749-5:2017 | Identical |
| I.S. EN 60749-5:2017 | Identical |
| DIN EN 60749-5:2003-09 | Identical |
| UNE-EN 60749-5:2003 | Identical |
| NF EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| NF EN 60749-4 : 2002 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
Summarise
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