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IEC 60749-10:2002

Superseded

Superseded

View Superseded by

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

Available format(s)

Hardcopy , PDF

Published date

04-09-2002

Superseded date

04-27-2022

Superseded by

IEC 60749-10:2022

US$14.00
Excluding Tax where applicable
Summarise this standard

FOREWORD
1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.The contents of the corrigendum of August 2003 have been included in this copy.

Committee
TC 47
DevelopmentNote
Supersedes IEC PAS 62186 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2019. (11/2017)
DocumentType
Standard
Pages
7
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

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